Light emitting device and method of manufacturing the same

ABSTRACT

Disclosed is a light emitting device and a method of manufacturing the same. The light emitting device includes a body, a first electrode installed in the body and a second electrode separated from the first electrode, a light emitting chip formed on one of the first and second electrodes, and electrically connected to the first and second electrodes, and a protective cap projecting between the first and second electrodes.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.14/825,785 filed on Aug. 13, 2015, which is a continuation of U.S.patent application Ser. No. 14/684,653 filed on Apr. 13, 2015, which isa continuation of U.S. patent application Ser. No. 14/290,783 filed onMay 29, 2014, which is a continuation of U.S. patent application Ser.No. 12/956,626 filed on Nov. 30, 2010, which claims priority under 35U.S.C. §119 to Korean Application Nos. 10-2009-0118084 filed on Dec. 1,2009, 10-2009-0118085 filed on Dec. 1, 2009 and 10-2010-0031987 filed onApr. 7, 2010, whose entire disclosures are hereby incorporated byreference.

BACKGROUND

1. Field

The embodiment relates to a light emitting device and a method ofmanufacturing the same.

2. Background

Light emitting diodes (LEDs) are a kind of semiconductor devices thatconvert electric energy into light. The LED is advantageous as comparedwith conventional light sources, such as a fluorescent lamp or a glowlamp, in terms of power consumption, life span, response speed, safetyand environmental-friendly requirement. In this regard, various studieshave been performed to replace the conventional light sources with theLEDs. The LEDs are increasingly used as light sources for lightingdevices such as various lamps used in the interior or the exterior of abuilding, liquid crystal displays, electric signboards, and streetlamps.

SUMMARY

The embodiment provides a light emitting device having a novel structureand a method of manufacturing the same.

The embodiment provides a light emitting device capable of improvingreliability and a method of manufacturing the manufacturing.

According to the embodiment, the light emitting device includes a body,a first electrode installed in the body and a second electrode separatedfrom the first electrode, a light emitting chip formed on one of thefirst and second electrodes, and electrically connected to the first andsecond electrodes, and a protective cap projecting between the first andsecond electrodes.

The embodiment can provide a light emitting device having a novelstructure and a method of manufacturing the same.

The embodiment can provide a light emitting device capable of improvingreliability and a method of manufacturing the manufacturing.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top perspective view showing a light emitting deviceaccording to the embodiment;

FIG. 2 is a bottom perspective view showing the light emitting device ofFIG. 1;

FIG. 3 is a plan view showing the light emitting device of FIG. 1;

FIG. 4 is a sectional view showing the light emitting device of FIG. 1;

FIG. 5 is a top perspective view showing first and second electrodes ofthe light emitting device according to the embodiment;

FIG. 6 is a bottom perspective view showing the first and secondelectrodes of FIG. 5;

FIGS. 7 to 10 are views showing a method of manufacturing the lightemitting device according to the embodiment;

FIG. 11 is a flowchart showing the method of manufacturing the lightemitting device according to the embodiment;

FIG. 12 is a top perspective view showing the first and secondelectrodes;

FIG. 13 is a view showing the dimension of the light emitting device ofFIG. 1;

FIG. 14 is a view showing a scheme in which a body is coupled with anelectrode (first electrode or second electrode);

FIGS. 15 to 18 are views showing electrodes (first or second electrode)according to first, second, and third embodiments;

FIGS. 19 to 21 are views showing corner regions of an electrode (firstor second electrode) according to one embedment of the disclosure;

FIG. 22 shows an electrode structure of a light emitting deviceaccording to another embodiment of the present invention;

FIG. 23 shows an example in which an electrode is coupled with a bodyaccording to one embodiment;

FIG. 24 is a view showing an electrode according to still anotherembodiment of the disclosure; and

FIG. 25 is a view showing one example in which a body is coupled with anelectrode.

DETAILED DESCRIPTION OF THE EMBODIMENTS

In the description of the embodiments, it will be understood that, whena layer (or film), a region, a pattern, or a structure is referred to asbeing “on” or “under” another substrate, another layer (or film),another region, another pad, or another pattern, it can be “directly” or“indirectly” over the other substrate, layer (or film), region, pad, orpattern, or one or more intervening layers may also be present. Such aposition of the layer has been described with reference to the drawings.

The thickness and size of each layer shown in the drawings may beexaggerated, omitted or schematically drawn for the purpose ofconvenience or clarity. In addition, the size of elements does notutterly reflect an actual size.

Hereinafter, a light emitting device 1 and a method of manufacturing thesame according to the embodiment will be describe with reference toaccompanying drawings.

FIG. 1 is a top perspective view showing the light emitting device 1according to the embodiment, and FIG. 2 is a bottom perspective viewshowing the light emitting device 1 according to the embodiment. FIG. 3is a plan view showing the light emitting device 1, and FIG. 4 is asectional view showing the light emitting device 1.

Referring to FIGS. 1 to 4, the light emitting device 1 according to theembodiment includes a body 20 provided at one lateral surface or morethereof with a roughness 25, first and second electrodes 31 and 32installed in the body 20, a light emitting chip 10 mounted on one of thefirst and second electrodes 31 and 32 and electrically connected to thefirst electrode 31 or the second electrode 32 to emit light, and aprotective cap 27 protruding between the first and second electrodes 31and 32.

The body 20 may include at least one selected from the group consistingof resin material such as PPA (Polyphthalamide), Si (Silicon), metallicmaterial, PSG (photo sensitive glass), sapphire (Al2O3), and (PCB(Printed Circuit Board).

If the body 20 includes electrically conductive material, an insulatinglayer (not shown) may be additionally formed on the surface of the body20, so that the body 20 can be prevented from forming a short-circuitwith the first and second electrodes 31 and 32.

The body 20 may have a top surface in various shapes such as therectangular shape, a polygonal shape, and a circular shape according tothe use and design of the light emitting device 1. For example, as shownin FIG. 1, the light emitting device 1 having a rectangular shape may beused for an edge-type BLU (Backlight Unit).

A cavity 15 may be formed in the body 20 such that an upper portion ofthe body 20 is opened. The cavity 15 may have a cup shape or a concavevessel shape. An internal lateral surface of the cavity 15 may beperpendicular to the bottom surface of the body 20 or inclined withrespect to the bottom surface of the body 20.

When viewed in a plan view, the cavity 15 may have a circular shape, arectangular shape, a polygonal shape, or an oval shape. In addition, asshown in FIGS. 1 and 3, the cavity 15 may have a rectangular shape witha curved corner when viewed in a plan view.

The roughness 25 may be formed on at least one lateral surface of thebody 20. The roughness 25 is formed by the manufacturing process of thelight emitting device 1 according to the embodiment, in detail, acutting process of separating a plurality of light emitting devices inthe unit of a device, but the embodiment will be described below.

In addition, a cathode mark 22 may be formed at the upper portion of thebody 20. The cathode mark 22 is used to distinguish between the firstand second electrodes 31 and 32 of the light emitting device 1, so thatthe polarities of the first and second electrodes 31 and 32 can bedistinguished.

The first and second electrodes 31 and 32 are electrically insulatedfrom each other in the body 20. The first and second electrodes 31 and32 are electrically connected to the light emitting chip 10 to supplypower to the light emitting chip 10.

The first and second electrodes 31 and 32 may include metallic material,for example, may include at least one selected from the group consistingof Ti, Cu, Ni, Au, Cr, Ta, Pt, Sn, Ag, and P. The first and secondelectrodes 31 and 32 may have a single layer structure or a multi-layerstructure, but the embodiment is not limited thereto.

The first and second electrodes 31 and 32 pass through the bottomsurface of the body 20 to form the bottom surface of the light emittingdevice 1. Terminals of the first and second electrodes 31 and 32 may beexposed to the outside of the body 20.

Since the first and second electrodes 31 and 32 pass through the body20, heat generated from the light emitting chip 10 mounted on one of thefirst and second electrodes 31 and 32 may be discharged through thefirst electrode 31 or the second electrode 32.

Soldering may be performed with respect to the terminals of the firstand second electrodes 31 and 32 protruding out of the outside of thebody 20, such that the light emitting device 1 may be easily mounted onan external member such as a substrate.

Hereinafter, the first and second electrodes 31 and 32 will be describedin more detail.

FIG. 5 is a top perspective view showing the first and second electrodes31 and 32, and FIG. 6 is a bottom perspective view showing the first andsecond electrodes 31 and 32.

Referring to FIGS. 5 and 6, the terminals of the first and secondelectrodes 31 and 32 exposed out of the body 20 may be branched into aplurality of sub electrodes 31 a and 31 b and a plurality of subelectrodes 32 a and 32 b, respectively. For example, as shown in FIG. 5,the terminal of the first electrode 31 is branched into the two firstsub electrodes 31 a and 31 b, and the terminals of the second electrode32 may be branched into the two second sub electrodes 32 a and 32 b.

Upper and lower portions of lateral surfaces of a first recess part 35 abetween the two first sub electrodes 31 a and 31 b and a second recesspart 35 b between the two second sub electrodes 32 a and 32 b may havestep structures, and the lower portion of the lateral surfaces may havea curved surface.

Protrusions 33 a, 33 b, and 33 c may be formed from a top portion of atleast one lateral surface of the first and second electrodes 31 and 32.The protrusions 33 a, 33 b, and 33 c have a step structure with respectto bottom portions of the first and second electrodes 31 and 32.Accordingly, a region in which the widths of the top surfaces of thefirst and second electrodes 31 and 32 may be greater than the widths ofthe bottom surfaces of the first and second electrodes 31 and 32 by theprotrusions 33 a, 33 b, and 33 c, may be formed, and may have a sectionin the shape of T.

Two facing lateral surfaces 34 a and 34 b of the first and secondelectrodes 31 and 32 may be inclined or may have a step structure.

The body 20 and the first and second electrodes 31 and 32 may be firmlycoupled with each other, and the first and second electrodes 31 and 32can be prevented from being separated from the body 20 by the abovestructure of the first and second electrodes 31 and 32. In addition,since the surface area of the first and second electrodes 31 and 32 isincreased due to the structure, the light emission efficiency of thelight emitting device 1 can be improved.

Even if the first and second electrodes 31 and 32 have differentthicknesses according to regions, the first and second electrodes 31 and32 have to preferably have a sufficient thickness to form the bottomsurface of the light emitting device 1. To this end, the thickness ofthe first and second electrodes 31 and 32 may be in the range of about0.1 mm to about 0.5 mm, but the embodiment is not limited thereto.

Referring to FIGS. 1 to 4 again, the protective cap 27 may protrudebetween the first and second electrodes 31 and 32. The protective cap 27covers the gaps among the first electrode 31, the second electrode 32,and the body 20 to prevent moisture or air from infiltrating into thelight emitting device 1 and prevent the gap from being widened in thelong term, so that the reliability for the light emitting device 1 canbe improved.

The protective cap 27 protrudes between the first and second electrodes31 and 32. Accordingly, the protective cap 27 may be integrated with thebody 20 in the manufacturing process of the light emitting device 1, andmay include a material the same as that of the body 20.

The protective cap 27 may be separated from the body 20. In this case,the protective cap 27 includes a material different from that of thebody 20.

The protective cap 27 protrudes between the first and second electrodes31 and 32 in order to cover the gap between the first and secondelectrodes 31 and 32 and the body 20, so that the protective cap 27 maysurround lateral surfaces and at least a portion of the top surfaces ofthe first and second electrodes 31 and 32.

For example, as shown in FIG. 4, when the first and second electrodes 31and 32 are spaced apart from each other at a first distance c, a width aof the protective cap 27 is 0.02 mm to 0.5 mm greater than the firstdistance c, so that the protective cap 27 may surround the lateralsurfaces and at least a portion of the top surfaces of the first andsecond electrodes 31 and 32, but the embodiment is not limited thereto.

Although a thickness b of the protective cap 27 may be in the range of0.01 mm to 0.1 mm, the thickness b may have various values to ensure thereliability and the workability for the protective cap 27.

The light emitting chip 10 may be mounted on one of the first and secondelectrodes 31 and 32, and electrically connected to the first and secondelectrodes 31 and 32 to receive power such that light can be generated.Since the light emitting chip 10 is mounted on one of the first andsecond electrodes 31 and 32, the light generated from the light emittingchip 10 is effectively transferred to the first and second electrodes 31and 32 and discharged to the outside.

For instance, the light emitting chip 10 may include at least one LED(light emitting diode), and the LED may include a color LED to emit red,green, blue, white light or a UV (Ultra Violet) LED to emit aultraviolet ray, but the embodiment is not limited thereto.

The light emitting device 1 is electrically connected to the firstelectrode 31 or the second electrode 32 through a wire bonding scheme.

The light emitting device 1 is electrically connected to the firstelectrode 31 or the second electrode 32 through a flip chip bondingscheme or a die bonding scheme.

As shown in FIG. 4, an encapsulant 40 may be formed in the cavity 15 ofthe body 20 to seal and protect the light emitting chip 10. Theencapsulant 40 may include a luminescence material.

The encapsulant 40 may include silicon or resin material. Theencapsulant 40 may be formed by hardening the silicon or the resinmaterial that has been filled in the cavity 15, but the embodiment isnot limited thereto.

The luminescence material may be contained in the encapsulant 40, andmay be excited by a first light emitted from the light emitting chip 10to generate a second light. For example, when the light emitting chip 10includes a blue LED, and the luminescence material includes a yellowluminescence material, the yellow luminescence material is excited byblue light to emit yellow light. Therefore, the blue light is mixed withthe yellow light, so that the light emitting device 1 can provide whitecolor light, but the embodiment is not limited thereto.

Meanwhile, a lens (not shown) is additionally formed over theencapsulant 40, so that the distribution of light emitted from the lightemitting device 1 can be adjusted. In addition, a zener diode to improvethe withstanding voltage may be additionally installed in the body 20 ofthe light emitting device 1.

Hereinafter, the method of manufacturing the light emitting device 1according to the embodiment will be described in detail.

FIGS. 7 to 10 are views showing the method of manufacturing the lightemitting device 1 according to the embodiment, and FIG. 11 is aflowchart showing the method of manufacturing the light emitting device1 according to the embodiment.

First, referring to FIG. 7, an electrode frame 30 on which the first andsecond electrodes 31 and 32 are formed is prepared (step S101 of FIG.11).

A plurality of light emitting devices 1 can be simultaneouslymanufactured by forming the electrode frame 30. For example, theelectrode frame 30 may be formed through a photolithography process, aplating process, or a deposition process, but the embodiment is notlimited thereto.

Second, referring to FIG. 8, after providing the electrode frame 30 on acast having a shape of a plurality of bodies 20, material forming thebody 20 is injected through an injection hole of the cast, therebyforming the bodies 20 (see step S102 of FIG. 11).

FIGS. 9A to 9C are views showing the processes of forming the body 20.Hereinafter, the method of manufacturing the body 20 will be describedin more detail with reference to FIG. 9A to 9C.

Referring to FIG. 9A, the electrode frame 30 is provided on casts 100and 200. The cast 100 and 200 may include the first cast 200corresponding to the shape of a lower portion of the body 20 and thesecond cast 100 corresponding to the shape of an upper portion of thebody 20.

At least one of the first and second frames 200 and 100 may includeinjection holes 110 used to inject material forming the body 20. In thiscase, the injection holes 110 may be formed between the shapes of thebodies 20.

For example, as shown in FIGS. 9A to 9B, each injection hole 110 may beformed between at least two bodies. The position of such an injectionhole 110 enables at least two bodies 20 to be simultaneously integratedwith each other.

Then, referring to FIG. 9B, material forming the body 20 may be injectedthrough the injection hole 110. For example, the material forming thebody 20 may include resin material such as PPA, but the embodiment isnot limited thereto.

Referring to FIG. 9C, after hardening the material forming the body 20,the first frame 200 is separated from the second frame 100, and thebodies 20 can be provided

As shown in FIG. 8 and FIG. 9C, a connection part 28 may be formedbetween at least two bodies 20 that are simultaneously integrated witheach other, and a mark 29 of the injection hole 110 may be formed at thecentral portion of the connection part 28.

As described above, since at least two bodies 20 are simultaneouslyformed by one injection hole 110 in the method of manufacturing thelight emitting device 1 according to the embodiment, the efficiency ofthe manufacturing process can be improved.

Third, referring to FIGS. 8 and 10, the light emitting chip 10 ismounted on one of the first and second electrodes 31 and 32 (see stepS103 of FIG. 11), and the light emitting chip 10 may be electricallyconnected to the first and second electrodes 31 and 32 through wirebonding (see step S104 of FIG. 11).

Four, the encapsulant 40 may be formed in the cavity 15 of the body 20to seal and protect the light emitting chip 10 (see step S105 of FIG.11).

Fifth, the light emitting devices 1 may be separated from each other inthe unit of an individual device through a cutting process (see stepS106 of FIG. 11).

In other words, according to the cutting process, at least two lightemitting devices integrated with each other in the previous process maybe separated from each other in the unit of an individual device.

In detail, the cutting process may include a process of separating thefirst and second electrodes 31 and 32 from the electrode fame 30 and aprocess of separating at least two integrated bodies 20 from each other.

Particularly, as shown in FIG. 10, in the process of separating at leasttwo integrated bodies 20 from each other, the roughness 25 may be formedon at least one lateral surface of the body 20. In other words, theroughness 25 refers to a rough surface formed when the connection part128 is removed through the cutting process.

The cutting process may be physically performed by using a cutter, butthe embodiment is not limited thereto.

Meanwhile, the manufacturing process of the light emitting device 1 maybe performed in the inverse sequence, but the sequence of themanufacturing process is not limited. For example, after the cuttingprocess has been primarily performed, a process of installing the lightemitting chip may be performed.

Hereinafter, another embodiment of the first and second electrodes ofFIG. 1 will be described in detail.

FIG. 12 is a top perspective view showing the first and secondelectrodes 31 and 32 in detail.

Hereinafter, the first and second electrodes 31 and 32 of FIG. 12 willbe described while focusing on the difference from the first and secondelectrodes 31 and 32 of FIG. 5 because the first and second electrodes31 and 32 of FIG. 12 are partially similar to the first and secondelectrodes 31 and 32 of FIG. 5.

The terminals of the first and second electrodes 31 and 32 exposed outof the body 20 are branched into the sub electrodes 31 a and 31 b andthe sub electrodes 32 a and 32 b, respectively.

In other words, the terminal of the first electrode 31 is branched intothe two first sub electrodes 31 a and 31 b, and the terminal of thesecond electrode 32 is branched into the two sub electrodes 32 a and 32b.

In addition, a coupling region 35 a is formed between two first subelectrodes 31 a and 31 b, so that the body 20 can be solidly coupledwith the first sub electrodes 31 a and 31 b. When the body 20 includingthe first and second electrodes 31 and 32 is formed, the coupling region35 a may be formed by infiltrating material constituting the body 20into the space between the first sub electrodes 31 a and 31 b. If thebody 20 includes metallic material or substrate material instead ofresin material, the coupling region 35 a allows a portion of the body 20to be inserted into the space between the first sub electrodes 31 a and31 b, so that the first electrode 31 can be prevented from beingseparated from the body 20.

In addition, on a contact surface between the coupling region 35 a andthe first sub electrodes 31 a and 31 b, an inclined surface may beformed, or a step difference is formed by the inclined surface. Inaddition, the contact surface may be curved.

Similarly to the first electrode 31, the second electrode 32 may have acoupling region 35 b between two sub electrodes 32 a and 32 b branchingfrom the terminal of the second electrode 32. The second electrode 32may be firmly fixed onto the body 20 by the coupling region 35 b.

Coupling pins 33 a to 33 f may be formed on at least one lateral surfaceof the first and second electrodes 31 and 32.

The coupling pins 33 a to 33 f form a step difference from lowerportions of the first and second electrodes 31 and 32. Accordingly, aregion in which the widths of the top surfaces of the first and secondelectrodes 31 and 32 may be greater than the widths of the bottomsurfaces of the first and second electrodes 31 and 32 may be formed, andmay have a section in the shape of T.

The facing lateral surfaces 34 a and 34 b of the first and secondelectrodes 31 and 32 may be inclined or may have a step structure.

As described above, the body 20 and the first and second electrodes 31and 32 can be firmly coupled with each other by the coupling structureof the first and second electrodes 31 and 32.

Since the first and second electrodes 31 and 32 have the T-shape sectionin a width direction, when the first and second electrodes 31 and 32 arecoupled with material forming the body 20, the material forming the body20 prevents the top surface of the T-shape structure from moving in adirection of Z. In addition, since the coupling pins 33 a to 33 fprotrude toward the molding material of the body 20, after the materialof the body 20 is hardened, the first and second electrodes 31 and 32cannot be easily separated from each other in directions C or D.

The area of the electrodes on which the light emitting chip 10 ismounted is not reduced due to the T-shape structure, and the wholesectional area is increased along a T-shape outer peripheral surface.Accordingly, the T-shape structure increases the whole sectional area ofthe electrodes as compared with the typical electrodes and having arectangular shape. Accordingly, the increase of the sectional area canimprove a heat dissipation characteristic of the light emitting chip 10.

In the first electrode 31, the coupling pins 33 a to 33 d protrude in adirection A or B, and may be formed in adjacent to coupling grooves 33 gand 33 h. In addition, the coupling pins 33 a to 33 d may be alternatelyaligned with the coupling grooves 33 g and 33 h. When the coupling pins33 a to 33 d are alternately aligned with the coupling grooves 33 g and33 h in the first electrode 31, the concavo-convex structure formed bythe coupling pins 33 a to 33 d and the coupling grooves 33 g and 33 h inthe first electrode 31 allows the first electrode 31 to be firmlycoupled with the molding material of the body 20.

Although FIG. 12 shows that the coupling pins 33 a to 33 d are arrangedin adjacent to the coupling grooves 33 g and 33 h, the coupling pins 33a to 33 d and the coupling grooves 33 g and 33 h may be alternatelyaligned with each other in the first electrode 31.

The coupling grooves 33 g and 33 h are recessed into the lateralsurfaces of the sub electrodes 31 a, 31 b, 32 a, and 32 b protrudingfrom the terminals of the first electrode 31 or the second electrode 32,and have a step difference from the exposed surfaces of the subelectrodes 31 a, 31 b, 32 a, and 32 b. Hereinafter, the coupling groovesand the sub electrodes will be described while focusing on referencenumbers 33 g and 31 b.

As shown in FIG. 12, since the coupling groove 33 g is formed byrecessing a portion of an exposed surface 31 b 11 of the sub electrode31 b inward, the coupling groove 33 g makes a step difference from aprotruding surface 33 a 1 of the coupling pin 33 a. The exposed surface33 g 1 of the coupling groove 33 g has a depth G11 from the exposedsurface 31 b 11 of the sub electrode 31 b. In other words, since thecoupling groove 33 g is formed in parallel to the exposed surface 31 b11 of the sub electrode 31 b and the protruding surface 33 a 1 of thecoupling pin 33 a and deeply recessed by the depth G11 from the exposedsurface 31 b 11, the coupling groove 33 g makes a greater stepdifference. The coupling groove 33 g is filled with a greater amount ofmolding material of the body 20 due to the step difference. After themolding material has been hardened, the coupling groove 33 g is morefirmly coupled with the body 20.

The exposed surface 31 b 11 of the sub electrode 31 b and the exposedsurface of the coupling groove 33 g preferably make a step sufficientdifference only if the electrode 31 b can be endured in strength.According to the present embodiment, the length G11 of the stepdifference may be in the range of about 0.01 mm to about 1 mm. However,preferably, the depth G11 in the first electrode 31 may correspond toabout 10% to about 20% of a length D3 of the first electrode 31 in thewidth direction.

Meanwhile, as a width D6 of the exposed surface 33 g 1 of the couplinggroove 33 g in a longitudinal direction is lengthened, the contactsurface between the exposed surface 33 g 1 and the molding material ofthe body 20 may be increased. The groove 33 g may be more firmly coupledwith the molding material of the body 20 by the increase of the contactsurface between the exposed surface 33 g 1 and the molding material.However, if a width WS between the coupling grooves 33 g and 33 h has agreat value, mechanical strength can be reduced in a region in which thewidth WS between the coupling grooves 33 g and 33 h is decreased.According to the present embodiment, the width D6 in the longitudinaldirection may be in the range of about 0.15 mm to about 0.6 mm, andpreferably corresponds to 10% to 16% of the width D5 of the firstelectrode 31 in the longitudinal direction.

The second electrode 32 is shorter than the first electrode 31. In orderto firmly couple the second electrode 32 with the body 20, couplingholes can be additionally formed in the second electrode 32 adjacent tothe coupling pines 33 e and 33 f by adjusting the sizes of the couplingpines 33 e and 33 f. At least one or two coupling grooves may beadditionally formed in the second electrode 32, but the embodiment isnot limited thereto.

In order to form the coupling grooves in the second electrode 32,preferably, a concavo-convex structure is formed at portions of thecoupling pins 32 e and 32 to form the coupling grooves for the secondelectrode 32, or the sizes of the coupling pins 32 e and 32 f may bereduced, and additional coupling grooves are formed in the adjacent tothe coupling pins 32 e and 32 f.

When the coupling pins 33 a and 33 b formed in the first electrode 31are formed in adjacent to the coupling groove 33 g, since the materialconstituting the body 20 are filled along an outer peripheral surface ofthe coupling pins 33 a and 33 b and the coupling grooves 33 g andhardened, and the coupling pins 33 a and 33 b are inserted into thehardened material of the body 20, the first electrode 31 may be veryfirmly coupled with the body 20. Similarly, the relation between thecoupling pins 33 c and 33 d and the coupling groove 33 h formed on thefirst electrode 31 is identical to the relation between the couplingpins 33 a and 33 b and the coupling groove 33 g.

FIG. 13 shows one example for the dimension of the light emitting deviceshown in FIGS. 1 and 12.

Referring to FIG. 13, when the first and second electrodes 31 and 32buried in the body 20 of the light emitting device are cut along lineAA-AA″ in the width direction, the first and second electrodes 31 and 32have a T shape. The dimension obtained from the section and theperspective view of the T shape is represented as follows.

-   -   Length of D1: 0.15 mm,    -   Length of D2: 0.1 mm,    -   Length of D3: 1.16 mm,    -   Length of D4: 0.3 mm,    -   Length of D5: 2.4 mm,    -   Length of D6: 0.3 mm,    -   Length of D7: 0.11 mm,    -   Length of D8: 0.3 mm,    -   Length of D9: 1.0 mm, and    -   Length of D10: 0.94 mm.

The dimensions of D1 to D10 are given as an example for the lightemitting device according to the disclosure, and the dimension of thelight emitting device according to the disclosure is not limitedthereto. The dimension of the light emitting device according to thedisclosure may be changed in order to improve the easiness and thereliability for the use of the light emitting device, and the model andthe manufacturing of the light emitting device.

Referring to the present drawing, the length D3 of the top surface of aT-shape section is 0.2 mm longer than the length of the bottom surfaceof the T-shape section, and a heat dissipation area may be moreincreased when the light emitting chip 10 is mounted.

In addition, since the length D3 of the top surface of a T-shape sectionis longer than the length of the bottom surface of the T-shape section,the electrode is supported by the body 20, so that the electrode can befirmly fixed onto the body 20.

As shown in the present drawing, the width D5 of the first electrode 31in the longitudinal direction is longer than that of the secondelectrode 32. Accordingly, referring to the present drawing, the lightemitting chip 10 may be preferably mounted on the first electrode 31 inwhich the heat dissipation area can be ensured. In this case, whenexternal power is applied through the first and second electrodes 31 and32, a zener diode (not shown) may be added to stabilize the voltage ofexternal power. In this case, the zener diode (not shown) is preferablymounted on the second electrode 32.

D1 represents the length between the top surface and the bottom surfaceof the first electrode 31 or the second electrode 32 having a T shape.

D2 represents the protrusion length of the coupling pin 33 d when thecoupling pin 33 d protrudes from the first electrode 31 or the secondelectrode 32.

D3 represents the length of the first electrode 31 or the secondelectrode 31 in the width direction.

D4 represents the thickness of the first electrode 31 or the secondelectrode 32, and D5 represents the length of the longer axis of thefirst electrode 31.

D6 represents the width of the bottom surface 33 g 1 of the couplinggroove 33 g in the longitudinal direction and may be in the range ofabout 0.15 mm to about 0.6 mm. The bottom surface 33 g 1 is buried bymaterial of the body 20 when the outer appearance of the body 20 isformed. When the material of the body 20 is hardened, the bottom surface33 g 1 may be firmly coupled with the body 20.

D7 represents the length between the protruding surface 33 a 1 of thecoupling pin 33 a, which protrudes with a length in the range of about0.05 mm to about 0.22 mm from the bottom surface 33 g 1 of the couplinggroove 33 g, and the bottom surface 33 g 1. According to the presentembodiment, D7 may be in the range of about 0.05 mm to about 0.22 mm. Asthe step difference between the protruding surface 33 a 1 of thecoupling pin 33 a and the bottom surface 33 g 1 is increased, an amountof material of the body 20 filled in the coupling groove 33 g isincreased. After the material of the body 20 has been hardened, sincethe coupling pin 33 a is deeply inserted into the material of the body20, the bonding strength among the coupling pin 33 a, the couplinggroove 33 g, and the body 20 is increased.

D8 represents the distance between the terminal of the sub electrode 31b and the coupling pin 33 a, and may be in the range of about 0.15 mm toabout 0.6 mm.

D9 represents the length of the longer axis of the second electrode 32and may be in the range of about 0.5 mm to about 2 mm.

D10 represents the dimension of the bottom surface of the T-shapesection of the first electrode 31 or the second electrode 32, and isshorter than the length of the top surface of the T-shape section, sothat the first electrode 31 or the second electrode 32 having the Tshape can be supported and fixed onto the body 20.

Referring to FIG. 13, regions Q1 and Q2 represent corners of the firstand second electrodes 31 and 32, respectively.

The regions Q1 and Q2 have the forms of gently recessed corners of thefirst and second electrodes 31 and 32, so that the curved surface of theregions Q1 and Q2 are coupled with the molding material.

FIG. 14 shows an example in which the body 20 is coupled with electrodes(the first electrode or the second electrode).

Referring to FIG. 14, after the material constituting the body 20 hasbeen filled in the coupling groove 33 g formed in the first electrode 31(or the second electrode that is omitted hereinafter), the material ofthe body 20 is hardened, so that the body 20 is coupled with the firstelectrode 31 in a concavo-convex structure.

When the body 20 constitutes the light emitting device package, themolding material of the body 20 is filled in the coupling groove 33 gforming a concavo-convex pattern on the lateral surface of the firstelectrode (or the second electrode). Thereafter, if the molding materialis hardened, the hardened molding material is filled in theconcavo-convex region formed by the first electrode 31 (or the secondelectrode) to form the outer appearance of the body 20. The body 20 isfirmly coupled with the first electrode 31 (or the second electrode)through a concavo-convex structure coupling relation. In this case, ifthe outer appearance of the body 20 is spoiled when the molding materialis hardened, a sanding process may be performed with respect to the body20 to flatten the outer portion of the body 20.

FIGS. 15 to 18 show electrodes (that is, the first and secondelectrodes) according to first, second, and third embodiments.

Referring to FIG. 15, coupling pins 41 and coupling grooves 42 arealternately aligned with each other on a lateral surface of an electrode40. According to the embodiment, the coupling pins 41 are alternatelyaligned with the coupling grooves 42 on the lateral surface of theelectrode 40 in such a manner that the coupling pins 41 protrude intothe molding material of the body 20 and fixed into the body 20, and themolding material of the body 20 is filled in the coupling groove 42 andfirmly coupled with the coupling groove 42 when the molding material ishardened.

Although the coupling pins 41 and the coupling grooves 42 are formed atboth lateral surfaces of the electrode 40 through the drawing and thedescription, the coupling pins 41 and the coupling grooves 42 may beformed even in a head region Q3 of the electrode 40. At least two orthree coupling pins 41 and coupling grooves 42 may be formed.

The electrode of FIG. 15 may be one of the first and second electrodes31 and 32 described with reference to FIGS. 1 to 14, and the aboveelectrodes will be not separately distinguished among them for thepurpose of explanation.

As shown in FIG. 15, reference numbers 40 a and 40 b represent subelectrodes exposed out of the body 20. The sub electrodes 40 a and 40 bmay be formed in parallel to the electrode 40, or the terminals of thesub electrodes 40 a and 40 b may be bent downward. Although the presentembodiment has been described in that the terminal of the electrode 40is branched into two sub electrodes 40 a and 40 b, the sub electrodes 40a and 40 b may not be branched.

The electrode 40 may include one of the first electrode 31 or the secondelectrode 32 of FIG. 5. If the first and second electrodes 31 and 32 ofFIG. 12 have the shape according to the present embodiment, the headregions Q3 of a pair of electrodes are provided in the body 20 whilefacing each other, and the molding material of the body 20 is filled inthe space between the two electrodes 31 and 32, so that the twoelectrodes 31 and 32 may be fixed in a state in which two electrodes arespaced apart from each other.

Referring to FIG. 16, the coupling pin 45 and the coupling groove 46have the structure similar to the structure of the pins and grooves ofFIG. 15 except that the thickness D11 of the coupling pin 45 is thinnerthan the thickness D12 of the first electrode 31, so that the electrode40 can be more firmly fixed onto the body 20. Referring to FIG. 16, themolding material of the body 20 is filled under the coupling pin 45 andfilled in the coupling groove 46. When the molding material of thecoupling pin 45 is filled under the coupling pin 45, the section of theelectrode 40 for the region Q4 of the electrode 40 having the couplingpins 45 and the coupling groove 46 forms the T shape, and the electrode40 is supported by the body 20 after the molding material has beenhardened. In this case, since the terminal of the coupling pin 45 isparallel to the outer peripheral surface of the body, the terminal isnot exposed out of the electrode 40.

Since the coupling pin 45 having a T shape is not exposed out of theouter peripheral surface of the first electrode 31 in the abovestructure, the coupling pin 45 can be prevented from being damaged ordeformed due to external force.

Referring to FIG. 17, coupling pins 47 protrude in the form of thetrapezoid from the electrode 40, and coupling grooves 48 having atriangular shape are alternately aligned with the coupling pins 47.Since the coupling groove 48 has a triangular shape deeply recessedinward from the electrode 40, an angle θ of the coupling groove 48 formsan acute angle with respect to the vertex of the triangle. After themolding material has been filled in the coupling groove 48 having anacute angle and hardened, the electrode 40 has strong resistance againstdirections F and G. In other words, since the electrode 40 is not easilyseparated in the direction F or G, and the coupling pin 47 hasresistance against a direction H or a direction inverse to the directionH by an angle of 180 degrees, the electrode 40 is firmly fixed onto thebody 20.

As shown in FIG. 17, the coupling pins 47 and the coupling grooves 48are formed along the lateral surface of the electrode 40. However, thecoupling pins 47 and the coupling grooves 48 may be formed in thedirection F of the electrode 40. At least one coupling pin 47 and atleast one coupling groove 48 may be formed. At least two coupling pins47 and at least two coupling pins 48 may be formed.

Although not shown, the coupling pin 47 may have a thickness differentfrom the thickness of the electrode 40, so that the coupling pin 47 andthe electrode 40 may have a step difference structure. If the couplingpin 47 and the electrode 40 have the step difference structure, theelectrode 47 is supported by the molding material of the body 20, sothat the electrode 47 is more firmly coupled with the body 20.

Referring to FIG. 18, protrusions or recesses are not formed on theelectrode 40, but two holes 51 and 52 are formed in the electrode 40 ina surface direction.

The holes 51 and 52 pass completely through the electrode 40. After themolding material infiltrates through the holes 51 and 52 and ishardened, the electrode 40 is firmly fixed onto the body 20 by thehardened molding material. Although FIG. 18 shows the holes 51 and 52having circular shapes, the holes 51 and 52 may be realized in acircular shape, an oval shape, a triangular shape, a rectangular shape,and a polygonal shape.

Two holes 51 and 52, three holes 51 and 52 or more are formed in theelectrode 40 to increase the bonding strength between the electrode 40and the body 20. The electrode 40 according to the present embodimenthas a very simple coupling structure with the body 20, so that thereliability and stability can be obtained due to the simplicity of thestructure.

FIGS. 19 to 21 show corners of the electrode (first electrode or secondelectrode) according to various embodiments of the disclosure.

Referring to FIG. 19, a corner region 61 has a rectangular shape. Whenthe corner region 61 has the rectangular shape, the electrode 60 issimply manufactured, and the whole structure of the light emittingdevice can be simplified.

Referring to FIG. 20, a corner region 62 may have a curved surfacerecessed inward from the electrode 60. When the corner region 62 has acurved surface recessed inward from the electrode 60, the area of thecorner region 62 is increased due to the curved surface. Accordingly,when packaging is performed by using molding material, the contactsurface between the corner region 62 and the molding material may beincreased. As the contact area is increased, the friction between thecorner region 62 of the electrode 60 and the molding material isincreased. Accordingly, after the molding material fixes the electrode60, the electrode 60 may be firmly coupled with the molding material.

Thereafter, referring to FIG. 21, a corner region 63 is recessed in arectangular shape, and may have resistance against directions I and J.For example, when the electrode 60 moves in a direction opposite to thedirection I, the molding material has resistance against the directionI, so that the movement of the electrode 60 can be blocked. In addition,when the electrode 60 moves in the direction opposite to the directionJ, the molding material has resistance against the direction J, so thatthe movement of the first electrode 31 is blocked. Similarly, althoughnot shown, the recess having the rectangular shape is formed at the leftof the electrode 60, and the electrode 60 is blocked from being moved inthe directions I and J and the directions opposite to the directions Iand J by the corner regions 63 formed symmetrically to each other at theleft and right of the electrode 60.

The corner region 6 formed in the right of the electrode 60 isidentically formed in the left of the electrode 60, which is not shownin FIG. 21, such that the corner regions are symmetrical to each other.Such symmetry may be applied to the embodiments of FIGS. 19 and 20.

FIG. 22 shows an electrode structure of a light emitting deviceaccording to another embodiment of the present invention, and FIG. 23shows an example in which the electrode of FIG. 22 is coupled with abody.

Referring to FIGS. 22 and 23, a guide groove 72 is formed in anelectrode 71 on which a light emitting chip 70 is mounted, and formedaround a light emitting chip 70 along the outer peripheral portion ofthe light emitting chip 70. The guide groove 72 is formed by recessingthe surface of the electrode 71 corresponding to the outer peripheralportion of the light emitting chip 70. The groove formed in the surfaceof the electrode 71 may have a circular shape, a rectangular shape, atriangular shape, and polygonal shapes along the outer peripheralsurface of the light emitting chip 70.

Since the guide groove 72 is recessed in the surface of the electrode71, the section of the guide groove 71, that is, the section of theelectrode having the groove may have a circular shape, a rectangularshape, a triangular shape, or a polygonal shape. FIG. 17 shows anexample in which the section of the groove has a triangular shape.

The guide groove 72 is spaced apart from one side of the outerperipheral surface of the light emitting chip 70 at a distance D15. Theguide groove 72 makes the access path of the foreign matters, whichinfiltrate through the protective cap 74, in the shape of V andincreases the access path if the molding material of the body hasinfiltrated and hardened, thereby blocking the foreign matters fromaccessing the light emitting chip 70.

The first electrode 71 includes a first electrode 71 a and a secondelectrode 72 b to supply power to the light emitting chip 70. Since thefirst and second electrodes 71 a and 71 b supply one of a positivevoltage (+) and a negative voltage (−), the first and second electrodes71 a and 71 b need to be electrically insulated from each other.Accordingly, the first and second electrodes 71 a and 71 b are spacedapart from each other at the distance D14. Preferably, the distance D14has a range of about 0.1 mm to about 2 mm, and the range may beincreased or decreased according to the voltage or the quantity ofcurrent consumed in the light emitting chip 70. When the first electrode71 a is spaced apart from the second electrode 71 b, the protective cap74 provided in the space between the first and second electrodes 71 aand 71 b can prevent foreign matters, such as dust, moisture, andothers, from infiltrating to the space between the first and secondelectrodes 71 a and the second electrode 71 b through the lower portionof the body as much as possible. The protective cap 74 has a narrowertop surface and a wider bottom surface. An oblique path from the bottomsurface to the top surface is formed, so that the infiltration path offoreign matters between the first and second electrodes 71 a and 71 bcan be maximized.

However, even if the infiltration of the foreign matters is minimized byusing the structure, the foreign matters may infiltrate into a sealedregion by the protective cap 74. When the foreign matters introducedinto the sealed region move toward the light emitting chip 70, theaccess of the foreign matters is again blocked by the guide groove 72 atthe outer peripheral portion of the light emitting chip 70. Accordingly,the foreign matters cannot infiltrate into the light emitting chip 70 orthrough the outer peripheral portion of the light emitting chip 70.

FIG. 24 is a view showing an electrode according to another embodimentof the disclosure, and FIG. 25 is a view showing an example in which abody is coupled with an electrode.

Referring to FIGS. 24 and 25, a guide 82 is formed in an electrode 81 onwhich a light emitting chip 80 is mounted, and formed around the lightemitting chip 80 along an outer peripheral surface of the light emittingchip 80. The guide 82 protrudes to a top surface of the electrode 81.When a region of the electrode 81 in which the guide 82 is formed iscut, the cut surface has a structure in which a protrusion having atriangular shape, a rectangular shape, a semicircular shape, or otherpolygonal shapes projects from the surface of the electrode 81. As shownin FIG. 24, the rectangular protrusion corresponds to the guide 82.

The guide 82 may have one of a rectangular shape, a circular shape, atriangular shape, and other polygonal shapes formed around the lightemitting chip 80. In this case, the guide 82 need not have a symmetricstructure about the light emitting chip 80.

If necessary, one side of the guide 82 may be closer to the centralpoint of the light emitting chip 80, and an opposite side of the guide82 may be further away from the central point of the light emitting chip80.

The electrode 81 includes a first electrode 81 a and a second electrode81 b to supply power to the light emitting chip 80, and the first andsecond electrodes 81 a and 81 b are spaced apart from each other at thedistance D16 to prevent the first and second electrodes 81 a and 81 bfrom being electrically shorted.

Preferably, the distance D16 may be in the range of about 0.1 mm toabout 2 mm, and the range may be changed according to the quantity ofcurrent or voltage consumed in the light emitting chip 80.

The guide 82 is spaced apart from the light emitting chip 80 at apredetermined distance D17, and protrudes into the molding material 21constituting the body 20 so that a wall can be formed around the lightemitting chip 80. The guide 82 prevents foreign matters from moving fromthe light emitting chip 80 when the foreign matters infiltrate into thesealed region of the protective cap 84 to move toward the light emittingchip 80. As the height of the guide 82 is increased, the resistanceagainst the foreign matters is increased. However, since the lightemission efficiency from the light emitting chip 80 is reduced as theheight of the guide 82 is increased, the height of the guide 82 ispreferably set to a value identical to or lower than that of the lightemitting chip 80.

The protective cap 84 primarily prevents external foreign matters frominfiltrating into the light emitting chip 80 by sealing the spacebetween the first and second electrodes 81 a and 81 b. Top and bottomsurfaces of the protective cap 84 are arranged in line with top andbottom surfaces of the first and second electrodes 81 a and 81 b,respectively.

Although FIG. 25 shows that the top surface of the protective cap 84 isin line with the top surface of the electrode 81, the top surface of theprotective cap 84 additionally extends to the first and secondelectrodes 81 a and 81 b, so that the protective cap 84 may have a capshape. In this case, the protective cap 84 may have higher resistanceagainst the infiltration of the external foreign matters.

When the top surface of the protective cap 84 extends the direction ofthe top surface of the first and second electrodes 81 a and 81 b, theshape of the protective chap 84 may be identical to that of theprotective cap 27 of FIG. 4.

Any reference in this specification to “one embodiment,” “anembodiment,” “example embodiment,” etc., means that a particularfeature, structure, or characteristic described in connection with theembodiment is included in at least one embodiment of the disclosure. Theappearances of such phrases in various places in the specification arenot necessarily all referring to the same embodiment. Further, when aparticular feature, structure, or characteristic is described inconnection with any embodiment, it is submitted that it is within thepurview of one skilled in the art to effect such feature, structure, orcharacteristic in connection with other ones of the embodiments.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

What is claimed is:
 1. A light emitting device, comprising: a bodyhaving a length in a first direction and a width in a second direction;a first electrode having a planar top surface and a planar bottomsurface in the body, the first electrode including a first protrusionthat protrudes in the second direction from a first lateral side thereofand extending along the first lateral side thereof in the firstdirection, and a second protrusion that protrudes in the first directionfrom a second lateral side thereof and extending along the secondlateral side thereof in the second direction; a second electrodeseparated from the first electrode, the second electrode including athird protrusion that protrudes in the first direction from a thirdlateral side thereof and extending along the third lateral side thereofin the second direction; a light emitting chip disposed on the firstelectrode, the light emitting chip electrically connected to both of thefirst electrode and the second electrode; and a spacer being in contactwith both of the second lateral side of the first electrode and thethird lateral side of the second electrode, the spacer including aregion that a length between the second lateral side of the firstelectrode and the third lateral side of the second electrode graduallyincreases in a third direction from the planar top surface of the firstelectrode to the planar bottom surface of the first electrode, wherein aspace between the first protrusion of the first electrode and the planarbottom surface of the first electrode is filled by the body such that abottom surface of the body is flush with the planar bottom surface ofthe first electrode, wherein the first electrode includes two endportions separated from each other at the planar bottom surface of thefirst electrode in the second direction, and wherein each length of thetwo end portion s of the first electrode in the first direction islarger than 10% of a length of the first electrode in the firstdirection.
 2. The light emitting device of claim 1, wherein the firstprotrusion of the first electrode and the second protrusion of the firstelectrode are provided at a prescribed distance away from the planarbottom surface of the first electrode, and wherein the second electrodefurther includes a fourth protrusion that protrudes in the seconddirection from a fourth lateral side thereof and extends along thefourth lateral side thereof in the first direction, and wherein thethird protrusion of the second electrode and the fourth protrusion ofthe second electrode are provided at a prescribed distance away from theplanar bottom surface of the second electrode.
 3. The light emittingdevice of claim 2, wherein wherein both of the first lateral side of thefirst electrode and the fourth lateral side of the second electrode arecovered by the body.
 4. The light emitting device of claim 1, whereintop surfaces of the first and second protrusions of the first electrodeare coplanar with the planar top surface of the first electrode.
 5. Thelight emitting device of claim 2, wherein top surfaces of the third andfourth protrusions of the second electrode are coplanar with the planartop surface of the second electrode.
 6. The light emitting device ofclaim 1, wherein the first electrode includes a first recess provided ata fifth lateral side of the first electrode opposite the second lateralside, and wherein the second electrode includes a second recess providedat a sixth lateral side opposite the third lateral side of the secondelectrode.
 7. The light emitting device of claim 6, wherein the firstrecess is provided to form a pair of sub-electrodes at the fifth lateralside of the first electrode, and wherein the second recess is providedto form a pair of sub-electrodes at the sixth lateral side opposite thethird lateral side of the second electrode.
 8. The light emitting deviceof claim 6, wherein both of the first recess and the second recess arefilled with the body.
 9. The light emitting device of claim 6, wherein aprescribed distance of the first recess from the planar bottom surfaceof the first electrode is less than a distance between the planar topsurface of the first electrode and the planar bottom surface of thefirst electrode.
 10. The light emitting device of claim 1, wherein bothof the planar bottom surface of the first electrode and the planarbottom surface of the second electrode are exposed.
 11. A light emittingdevice, comprising: a body having a length in a first direction and awidth in a second direction; a first electrode having a planar topsurface and a planar bottom surface in the body, the first electrodeincluding a first protrusion that protrudes in the first direction froma first lateral side thereof and extending along the first lateral sidethereof in the second direction; a second electrode separated from thefirst electrode, the second electrode including a second protrusion thatprotrudes in the first direction from a second lateral side thereof andextending along the second lateral side thereof in the second direction;a light emitting chip disposed on the first electrode, the lightemitting chip electrically connected to both of the first electrode andthe second electrode; and a spacer disposed between the first lateralside of the first electrode and the second lateral side of the secondelectrode, wherein a width of the spacer between the first lateral sideof the first electrode and the second lateral side of the secondelectrode gradually increases in a third direction from the planar topsurface of the first electrode to the planar bottom surface of the firstelectrode, wherein the first electrode includes two end portionsseparated from each other at the planar bottom surface of the firstelectrode in the second direction, and wherein each length of the twoend portions of the first electrode in the first direction is largerthan 10% of a length of the first electrode in the first direction. 12.The light emitting device of claim 11, wherein the first electrodecomprises a third protrusion that protrudes in the second direction froma third lateral side thereof and extending along the third lateral sidethereof in the first direction, wherein the second electrode comprises afourth protrusion that protrudes in the second direction from a fourthlateral side thereof along the fourth lateral side thereof in the firstdirection.
 13. The light emitting device of claim 12, wherein a width ofthe third protrusion is smaller than 10% of a width of the planar topsurface of the first electrode in the second direction.
 14. The lightemitting device of claim 13, wherein a width of the fourth protrusion issmaller than 10% of a width of a top surface of the second electrode inthe second direction.
 15. The light emitting device of claim 13, whereinboth of the third lateral side of the first electrode and the fourthlateral side of the second electrode are covered by the body.
 16. Thelight emitting device of claim 13, wherein a space between the thirdprotrusion of the first electrode and the planar bottom surface of thefirst electrode is filled by the body such that a bottom surface of thebody is flush with the planar bottom surface of the first electrode. 17.The light emitting device of claim 12, wherein at least one cornerregion of the first electrode or the second electrode has a curvedsurface recessed inward from the first electrode or the secondelectrode.
 18. The light emitting device of claim 12, wherein the firstelectrode includes a first recess provided at a fifth lateral side ofthe first electrode opposite the first lateral side, and wherein thesecond electrode includes a second recess provided at a sixth lateralside opposite the second lateral side of the second electrode.
 19. Thelight emitting device of claim 18, wherein a prescribed distance of thefirst recess from the planar bottom surface of the first electrode isless than a distance between the planar top surface of the firstelectrode and the planar bottom surface of the first electrode.
 20. Thelight emitting device of claim 11, wherein the first electrode comprisesa third protrusion that protrudes in the second direction from a thirdlateral side thereof and extending along the third lateral side thereofin the third direction, and wherein the second electrode includes afourth protrusion that protrudes in the second direction from a fourthlateral side thereof along the third fourth lateral side thereof in thefirst direction, and both of the third lateral side of the firstelectrode and the third fourth lateral side of the second electrode arecovered by the body.